PCB
| Number of layers | single, double and multi-layers |
| Materials | FR1, FR2, FR3, FR4,CEM1,CEM3 |
| Material thickness | 0,2 - 3,2 mm |
| Copper thickness | 17 - 105 µm |
| Min. circuitry width | 0,1 mm |
| Min. spacing | 0,1 mm |
| Boring | 0,25 mm - 6,5 mm |
| Solder mask | UV or screen print |
| Printing | colour, carbon layer, peelable |
| Surface treatment | nickel, gold, HAL, organic |
| Outline | punching, scoring (V-cut), CNC routing |
| Inspection/testing | optical, electrical test |
| Quality | UL, ISO 9002 |
| Stencil | steel, laser-cut, stuck in AL frames |